In addition to sovereign radiation testing facilities, ANSTO offers capabilities that help users maximize test planning, execution, and results interpretation.
Integrated Circuit Decapsulation
Integrated circuits (IC) are commonly embedded in plastic packaging to protect the delicate chip die and bond wires, which hinders quality control procedures and radiation testing.
The Centre for Accelerator Science at ANSTO has developed facilities to decapsulate ICs using milling and heated acid jets, exposing the die while keeping it functional.
The etching process is tailored to each device's design, enabling radiation hardness testing essential for space applications. Full exposure of the die allows for imaging of specific regions and precise targeting to investigate their sensitivity. Additionally, direct exposure to radiation eliminates issues of energy and LET degradation caused by the packaging.
